ISSN 2380-4505
Vol. 2023, Issue Symposium, 2023February 23, 2024 EDT
Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element Analysis
Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element Analysis
Li, Guangxu, Siva Gurrum, Li Jiang, and Rajen Murugan. 2024. “Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element Analysis.” IMAPSource Proceedings 2023 (Symposium): 1–4. https://doi.org/10.4071/001c.94293.