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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022December 13, 2023 EDT

Additively Manufactured Wireless Sensors for Rugged IoT, Structural Health Monitoring, Smart Agriculture and Smart Cities Applications

Manos M. Tentzeris,
Additive ManufacturingInternet of Things5G
https://doi.org/10.4071/001c.91175
IMAPSource Conference Papers
Tentzeris, Manos M. 2023. “Additively Manufactured Wireless Sensors for Rugged IoT, Structural Health Monitoring, Smart Agriculture and Smart Cities Applications.” IMAPSource Proceedings 2022 (DPC): 849–901. https:/​/​doi.org/​10.4071/​001c.91175.
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