Vol. 2022, Issue DPC, 2022December 13, 2023 EDT
Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls
Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls
Rieder, B., W. Hartner, W. Yuan, G. Haubner, M. Niessner, J. Altmann, and B. Zhang. 2023. “Improving Reliability of Fan -Out Wafer Level Package Through Doping of Lead-Free Solder Balls.” IMAPSource Proceedings 2022 (DPC): 756–89. https://doi.org/10.4071/001c.91170.