ISSN 2380-4505
Vol. 2022, Issue DPC, 2022December 13, 2023 EDT
Advanced Fanout Embedded Bridge Packaging Technology for Chiplets Integration
Advanced Fanout Embedded Bridge Packaging Technology for Chiplets Integration
Cao, Lihong. 2023. “Advanced Fanout Embedded Bridge Packaging Technology for Chiplets Integration.” IMAPSource Proceedings 2022 (DPC): 718–36. https://doi.org/10.4071/001c.91168.