Vol. 2022, Issue DPC, 2022December 13, 2023 EDT
Design and Analysis Challenges of 3D Multi-Chiplet Heterogenous Architectures
Design and Analysis Challenges of 3D Multi-Chiplet Heterogenous Architectures
Park, John. 2023. “Design and Analysis Challenges of 3D Multi-Chiplet Heterogenous Architectures.” IMAPSource Proceedings 2022 (DPC): 640–54. https://doi.org/10.4071/001c.91164.