Vol. 2022, Issue DPC, 2022December 13, 2023 EDT
Heterogeneous Integration of Chiplets, Lego-like IP for More than Moore
Heterogeneous Integration of Chiplets, Lego-like IP for More than Moore
Felton, Keith. 2023. “Heterogeneous Integration of Chiplets, Lego-like IP for More than Moore.” IMAPSource Proceedings 2022 (DPC): 620–39. https://doi.org/10.4071/001c.91163.