Photo-Imageable Dielectrics Enabling Structured MEMS and 2.5D / 3D Bonding Systems

David Danza; Colin Hayes; Kevin Wang; Greg Prokopowicz; Paul Berry; Masaki Kondo; Michael Gallagher

doi:10.4071/001c.91162

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Danza, David, Colin Hayes, Kevin Wang, Greg Prokopowicz, Paul Berry, Masaki Kondo, and Michael Gallagher. 2023. “Photo-Imageable Dielectrics Enabling Structured MEMS and 2.5D / 3D Bonding Systems.” IMAPSource Proceedings 2022 (DPC): 588–619. https://doi.org/10.4071/001c.91162.

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