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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022
December 13, 2023 EDT
Advanced Packaging Capabilities at Intel
John Sotir
,
Heterogeneous Integration
Advanced Packaging Architectures
SHIP Program
•
https://doi.org/10.4071/001c.91155
IMAPSource Conference Papers
Sotir, John. 2023. “Advanced Packaging Capabilities at Intel.”
IMAPSource Proceedings
2022 (DPC): 503–16.
https://doi.org/10.4071/001c.91155
.
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