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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022December 13, 2023 EDT

State of The Art (SOTA) Heterogeneous Intergrated Packaging (SHIP) Program

Darren Crum,
T&AMtrusted and assured microelectronicsdepartment of defenseDoD modernization
https://doi.org/10.4071/001c.91151
IMAPSource Conference Papers
Crum, Darren. 2023. “State of The Art (SOTA) Heterogeneous Intergrated Packaging (SHIP) Program.” IMAPSource Proceedings 2022 (DPC): 482–502. https:/​/​doi.org/​10.4071/​001c.91151.
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