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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022December 13, 2023 EDT

Establishing a Packaging Ecosystem for GlobalFoundries Leadership Silicon Photonics Wafers –2022 view

Daniel Berger,
packaging ecosystemtechnology packagingGF 45SPCLO SiPh
https://doi.org/10.4071/001c.91148
IMAPSource Conference Papers
Berger, Daniel. 2023. “Establishing a Packaging Ecosystem for GlobalFoundries Leadership Silicon Photonics Wafers –2022 View.” IMAPSource Proceedings 2022 (DPC): 437–50. https:/​/​doi.org/​10.4071/​001c.91148.
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