ISSN 2380-4505
Vol. 2023, Issue DPC, 2023December 07, 2023 EDT
Processing and Reliability Testing of a Copper Pressure Sinter Paste for use in High Power Module, Die Attach Applications
Processing and Reliability Testing of a Copper Pressure Sinter Paste for use in High Power Module, Die Attach Applications
Payne, Dean. 2023. “Processing and Reliability Testing of a Copper Pressure Sinter Paste for Use in High Power Module, Die Attach Applications.” IMAPSource Proceedings 2023 (DPC): 1308–21. https://doi.org/10.4071/001c.90952.