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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 05, 2023 EDT

Warpage and Reliability Study of Large Size XDFOI(TM) FO-MCM fcBGA

Danfeng Yang, Nokibul Islam, Allen Xu, Coco Xu, Yaojian Lin,
warpagereliabilityMoore's LawchipletsXDFOIx-dimensional fan-out integration
https://doi.org/10.4071/001c.90887
IMAPSource Conference Papers
Yang, Danfeng, Nokibul Islam, Allen Xu, Coco Xu, and Yaojian Lin. 2023. “Warpage and Reliability Study of Large Size XDFOI(TM) FO-MCM fcBGA.” IMAPSource Proceedings 2023 (DPC): 1285–1307. https:/​/​doi.org/​10.4071/​001c.90887.
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