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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 05, 2023 EDT

Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-thinning

Jay Zhang, Andy Teng, Christina Yu, Julia Brueckner,
Warp controlWafter ultra-thinningglass-based solutions
https://doi.org/10.4071/001c.90886
IMAPSource Conference Papers
Zhang, Jay, Andy Teng, Christina Yu, and Julia Brueckner. 2023. “Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-Thinning.” IMAPSource Proceedings 2023 (DPC): 1259–84. https:/​/​doi.org/​10.4071/​001c.90886.
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