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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 05, 2023 EDT

Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography System

John Chang,
ABF+CCL substrateheterogeneous integrationadvanced integrated circuit substrates (AICS)fine resolutions lithographypattern distortion
https://doi.org/10.4071/001c.90883
IMAPSource Conference Papers
Chang, John. 2023. “Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography System.” IMAPSource Proceedings 2023 (DPC): 1230–58. https:/​/​doi.org/​10.4071/​001c.90883.

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