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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 05, 2023 EDT

Low Loss/Low CTE Semiconductor Carrier Packaging Thin Core Material

Caleb Ancharski,
chip packaging supply chainHDI applicationslow losslow CTEthermal expansion
https://doi.org/10.4071/001c.90882
IMAPSource Conference Papers
Ancharski, Caleb. 2023. “Low Loss/Low CTE Semiconductor Carrier Packaging Thin Core Material.” IMAPSource Proceedings 2023 (DPC): 1202–29. https:/​/​doi.org/​10.4071/​001c.90882.

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