High Speed Copper Plating Process for IC Substrate

Sean Fleuriel; Confesol Rodriguez; Kesheng Feng; Linyu Pan; Victoire Kayempi Tshitenge; Robert Moon; Dolores Cruz; Jon Hander

doi:10.4071/001c.90880

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Fleuriel, Sean, Confesol Rodriguez, Kesheng Feng, Linyu Pan, Victoire Kayempi Tshitenge, Robert Moon, Dolores Cruz, and Jon Hander. 2023. “High Speed Copper Plating Process for IC Substrate.” IMAPSource Proceedings 2023 (DPC): 1181–1201. https://doi.org/10.4071/001c.90880.

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