High Speed Copper Plating Process for IC Substrate

Fleuriel, Sean, Confesol Rodriguez, Kesheng Feng, Linyu Pan, Victoire Kayempi Tshitenge, Robert Moon, Dolores Cruz, and Jon Hander. 2023. “High Speed Copper Plating Process for IC Substrate.” IMAPSource Proceedings 2023 (DPC): 1181–1201. https:/​/​doi.org/​10.4071/​001c.90880.