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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
December 01, 2023 EDT
Enabling Co-Design of 3D Heterogeneous Packages
John Park
,
Heterogeneous Integration
multi-chiplet SiPs
Moore's Law
co-design
•
https://doi.org/10.4071/001c.90784
IMAPSource Conference Papers
Park, John. 2023. “Enabling Co-Design of 3D Heterogeneous Packages.”
IMAPSource Proceedings
2023 (DPC): 1150–73.
https://doi.org/10.4071/001c.90784
.
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