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ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023December 01, 2023 EDT

Enabling Co-Design of 3D Heterogeneous Packages

John Park,
Heterogeneous Integrationmulti-chiplet SiPsMoore's Lawco-design
https://doi.org/10.4071/001c.90784
IMAPSource Conference Papers
Park, John. 2023. “Enabling Co-Design of 3D Heterogeneous Packages.” IMAPSource Proceedings 2023 (DPC): 1150–73. https:/​/​doi.org/​10.4071/​001c.90784.

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