ISSN 2380-4505
Vol. 2023, Issue DPC, 2023December 01, 2023 EDT
Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and Verification
Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and Verification
Felton, Keith, John Ferguson, and Per Viklund. 2023. “Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and Verification.” IMAPSource Proceedings 2023 (DPC): 1132–49. https://doi.org/10.4071/001c.90783.