Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and Verification

Keith Felton; John Ferguson; Per Viklund

doi:10.4071/001c.90783

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Felton, Keith, John Ferguson, and Per Viklund. 2023. “Leveraging AI and ML to Augment Advanced Semiconductor Packaging Design and Verification.” IMAPSource Proceedings 2023 (DPC): 1132–49. https://doi.org/10.4071/001c.90783.

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