Vol. 2023, Issue DPC, 2023December 01, 2023 EDT
4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML Technologies
4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML Technologies
Tentzeris, M. M., and K. Hu. 2023. “4D mmW/5G Metasurfaces and Wireless Sensors Combining Additive Manufacturing, Morphing and ML Technologies.” IMAPSource Proceedings 2023 (DPC): 517–46. https://doi.org/10.4071/001c.90775.