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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
December 01, 2023 EDT
Defluxing of Copper Pillar Bumped Flip Chips
Ravi Parthasarathy
,
Umut Tosun
,
flip-chip technology
Cu-pillar bump
substrate cleaning
flux residues
•
https://doi.org/10.4071/001c.90768
IMAPSource Conference Papers
Parthasarathy, Ravi, and Umut Tosun. 2023. “Defluxing of Copper Pillar Bumped Flip Chips.”
IMAPSource Proceedings
2023 (DPC): 438–82.
https://doi.org/10.4071/001c.90768
.
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