Vol. 2023, Issue DPC, 2023November 30, 2023 EDT
Advanced Thermal Interface Materials: Assembly and Integration for System in Package
Advanced Thermal Interface Materials: Assembly and Integration for System in Package
Brenner, Kevin. 2023. “Advanced Thermal Interface Materials: Assembly and Integration for System in Package.” IMAPSource Proceedings 2023 (DPC): 377–93. https://doi.org/10.4071/001c.90737.