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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023November 30, 2023 EDT

Glass Devices for Next-Generation Packaging and RF Signal Conditioning

Jeb H. Flemming,
Photosensitive Glass-Ceramics (PSG)RF packaging solutionglass-ceramicintegrated passive devices
https://doi.org/10.4071/001c.90734
IMAPSource Conference Papers
Flemming, Jeb H. 2023. “Glass Devices for Next-Generation Packaging and RF Signal Conditioning.” IMAPSource Proceedings 2023 (DPC): 1037–63. https:/​/​doi.org/​10.4071/​001c.90734.

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