Vol. 2023, Issue DPC, 2023November 30, 2023 EDT
RF Packaging and Design for Development of High Performance 5G mmWave Modules
RF Packaging and Design for Development of High Performance 5G mmWave Modules
Ndip, Ivan, Thi Huyen Le, Kavin Murugesan, Uwe Maaß, Michael Kaiser, and Martin Schneider-Ramelow. 2023. “RF Packaging and Design for Development of High Performance 5G mmWave Modules.” IMAPSource Proceedings 2023 (DPC): 976–94. https://doi.org/10.4071/001c.90731.