Validating Flip Chip Package Models Through Experimental Deflection Measurements

Kevin Cox; Jason Krantz; Matt Borden; Steven Tonthat

doi:10.4071/001c.90691

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Cox, Kevin, Jason Krantz, Matt Borden, and Steven Tonthat. 2023. “Validating Flip Chip Package Models Through Experimental Deflection Measurements.” IMAPSource Proceedings 2023 (DPC): 924–42. https://doi.org/10.4071/001c.90691.

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