Vol. 2023, Issue DPC, 2023November 29, 2023 EDT
Validating Flip Chip Package Models Through Experimental Deflection Measurements
Validating Flip Chip Package Models Through Experimental Deflection Measurements
Cox, Kevin, Jason Krantz, Matt Borden, and Steven Tonthat. 2023. “Validating Flip Chip Package Models Through Experimental Deflection Measurements.” IMAPSource Proceedings 2023 (DPC): 924–42. https://doi.org/10.4071/001c.90691.