Vol. 2023, Issue DPC, 2023November 29, 2023 EDT
Toward Thinner and Higher Heat Dissipation Advanced Chip Embedded Power Supply Module Packaging
Toward Thinner and Higher Heat Dissipation Advanced Chip Embedded Power Supply Module Packaging
Takao, Katsuhiro, Atsushi Kuroha, Michihito Kawada, Ichiro Kono, Takashi Suzuki, and Yoshiaki Aizawa. 2023. “Toward Thinner and Higher Heat Dissipation Advanced Chip Embedded Power Supply Module Packaging.” IMAPSource Proceedings 2023 (DPC): 867–91. https://doi.org/10.4071/001c.90688.