Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
November 29, 2023 EDT
Advanced IC Substrates for Heterogeneous Integration
Markus Leitgeb
,
Venkata Mokkapati
,
Rozalia Beica
,
advanced IC substrates
heterogeneous integration
advanced packaging
fan-out
•
https://doi.org/10.4071/001c.90686
IMAPSource Conference Papers
Leitgeb, Markus, Venkata Mokkapati, and Rozalia Beica. 2023. “Advanced IC Substrates for Heterogeneous Integration.”
IMAPSource Proceedings
2023 (DPC): 846–66.
https://doi.org/10.4071/001c.90686
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
