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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
November 29, 2023 EDT
Thermo-compression Bonding Assembly Technology
Bob Chylak
,
thermo-compression bonding
heterogenous integration
packaging
fluxless bonding
•
https://doi.org/10.4071/001c.90684
IMAPSource Conference Papers
Chylak, Bob. 2023. “Thermo-Compression Bonding Assembly Technology.”
IMAPSource Proceedings
2023 (DPC): 813–45.
https://doi.org/10.4071/001c.90684
.
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