Vol. 2023, Issue DPC, 2023November 29, 2023 EDT
D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System Integration
D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System Integration
Uhrmann, Thomas, Jürgen Burggraf, Mariana Pires, Chun Ho Fan, Hoi Ping Ng, and Ming Li. 2023. “D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System Integration.” IMAPSource Proceedings 2023 (DPC): 718–46. https://doi.org/10.4071/001c.90680.