Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:24995/feed
Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023November 16, 2023 EDT

Novel IR Laser Debonding for Heterogeneous and 3D Integration

Thomas Uhrmann, Peter Urban, Markus Wimplinger, Boris Povazay, Julian Bravin, Bernd Thallner,
Novel laser debondingheterogeneous and 3D integrationhybrid bondingadvanced packaging
https://doi.org/10.4071/001c.90230
IMAPSource Conference Papers
Uhrmann, Thomas, Peter Urban, Markus Wimplinger, Boris Povazay, Julian Bravin, and Bernd Thallner. 2023. “Novel IR Laser Debonding for Heterogeneous and 3D Integration.” IMAPSource Proceedings 2023 (DPC): 354–76. https:/​/​doi.org/​10.4071/​001c.90230.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system