Vol. 2023, Issue DPC, 2023November 16, 2023 EDT
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types
Farris, Glenn. 2023. “Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types.” IMAPSource Proceedings 2023 (DPC): 262–80. https://doi.org/10.4071/001c.90227.