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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
November 16, 2023 EDT
6G Hardware System Design and Packaging Needs
P M Raj
,
Satheesh Venkatakrishnan
,
John Volakis
,
beamforming architectures
reconfigurable intelligent surfaces
package integration trends
•
https://doi.org/10.4071/001c.90220
IMAPSource Conference Papers
Raj, P M, Satheesh Venkatakrishnan, and John Volakis. 2023. “6G Hardware System Design and Packaging Needs.”
IMAPSource Proceedings
2023 (DPC): 180–219.
https://doi.org/10.4071/001c.90220
.
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