Vol. 2023, Issue DPC, 2023November 16, 2023 EDT
Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-Packages
Using M-Series with Adaptive Patterning to shrink PCB systems into System-In-Packages
Locke, Justin, and Robin Davis. 2023. “Using M-Series with Adaptive Patterning to Shrink PCB Systems into System-In-Packages.” IMAPSource Proceedings 2023 (DPC): 129–53. https://doi.org/10.4071/001c.90212.