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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
November 16, 2023 EDT
Thin and Ultra-thin Sidewall Protected P-WLCSP
Doug Hackler
,
Ed Prack
,
advanced packaging
protected WLCSP
die sidewall
•
https://doi.org/10.4071/001c.90211
IMAPSource Conference Papers
Hackler, Doug, and Ed Prack. 2023. “Thin and Ultra-Thin Sidewall Protected P-WLCSP.”
IMAPSource Proceedings
2023 (DPC): 114–28.
https://doi.org/10.4071/001c.90211
.
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