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Device Packaging Conference Presentations
Vol. 2023, Issue DPC, 2023
November 16, 2023 EDT
Chiplets Integration: Simplifying the Landscape
Mike Kelly
,
Dave Hiner
,
Geroge Scott
,
Heterogenous integration
IC Packaging industry
die-to-die interface
•
https://doi.org/10.4071/001c.90198
IMAPSource Conference Papers
Kelly, Mike, Dave Hiner, and Geroge Scott. 2023. “Chiplets Integration: Simplifying the Landscape.”
IMAPSource Proceedings
2023 (DPC): 32–48.
https://doi.org/10.4071/001c.90198
.
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