Vol. 2023, Issue DPC, 2023November 14, 2023 EDT
Scaling Interconnect Densities Meeting the Growing Demand for Chiplet Integration
Scaling Interconnect Densities Meeting the Growing Demand for Chiplet Integration
Davis, Robin, and Tim Olson. 2023. “Scaling Interconnect Densities Meeting the Growing Demand for Chiplet Integration.” IMAPSource Proceedings 2023 (DPC): 1–31. https://doi.org/10.4071/001c.90161.