Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch chip last FO-WLPs

Yoshinori Matsuura; Vivek B. Dutta

doi:10.4071/001c.90160

Matsuura, Yoshinori, and Vivek B. Dutta. 2023. “Influence of Rigid Carrier Substrates & Its Release Layer on Ultra Fine Pitch Chip Last FO-WLPs.” IMAPSource Proceedings 2022 (DPC): 380–407. https://doi.org/10.4071/001c.90160.

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Influence of Rigid Carrier Substrates & its Release Layer on Ultra Fine Pitch chip last FO-WLPs

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