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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022November 14, 2023 EDT

The Grinding and Polishing Technology for Various Materials

Bob Pinto, Peter Clayfield, Takeru Inoue,
Okamoto Technology Grind Polishhigh pressure dressing (HPD)grinding various metalsautomatic double side grind
https://doi.org/10.4071/001c.90158
IMAPSource Conference Papers
Pinto, Bob, Peter Clayfield, and Takeru Inoue. 2023. “The Grinding and Polishing Technology for Various Materials.” IMAPSource Proceedings 2022 (DPC): 324–45. https:/​/​doi.org/​10.4071/​001c.90158.
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