Vol. 2022, Issue DPC, 2022November 14, 2023 EDT
Laser Processing of Polyimide and Molybdenum Substrates for Extreme Environment Electronics
Laser Processing of Polyimide and Molybdenum Substrates for Extreme Environment Electronics
Peek, Sherman, and Michael Hamilton. 2023. “Laser Processing of Polyimide and Molybdenum Substrates for Extreme Environment Electronics.” IMAPSource Proceedings 2022 (DPC): 179–99. https://doi.org/10.4071/001c.90152.