How to Tailor Immersion Tin Plating for IC Substrate Applications

Britta Schafsteller; Gustavo Ramos; Hubertus Mertens

doi:10.4071/001c.90147

Schafsteller, Britta, Gustavo Ramos, and Hubertus Mertens. 2023. “How to Tailor Immersion Tin Plating for IC Substrate Applications.” IMAPSource Proceedings 2022 (DPC): 1032–57. https://doi.org/10.4071/001c.90147.

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How to Tailor Immersion Tin Plating for IC Substrate Applications

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