Vol. 2022, Issue DPC, 2022November 10, 2023 EDT
High-density Fan-Out Chip on Substrate using M-Series (TM) and Adaptive Patterning® Technology
High-density Fan-Out Chip on Substrate using M-Series (TM) and Adaptive Patterning® Technology
Davis, Robin, Benedict San Jose, John Hunt, and Chia-Pin Chen. 2023. “High-Density Fan-Out Chip on Substrate Using M-Series (TM) and Adaptive Patterning® Technology.” IMAPSource Proceedings 2022 (DPC): 100–133. https://doi.org/10.4071/001c.90035.