ISSN 2380-4505
Vol. 2022, Issue DPC, 2022November 10, 2023 EDT
Designing Silicon Interposers for 2.5/3DIC Heterogeneous Integration - Meeting Foundry and OSAT Requirements
Designing Silicon Interposers for 2.5/3DIC Heterogeneous Integration - Meeting Foundry and OSAT Requirements
Cone, Chris, and Jamie Metcalfe. 2023. “Designing Silicon Interposers for 2.5/3DIC Heterogeneous Integration - Meeting Foundry and OSAT Requirements.” IMAPSource Proceedings 2022 (DPC): 64–84. https://doi.org/10.4071/001c.90025.