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Device Packaging Conference Presentations
Vol. 2022, Issue DPC, 2022November 10, 2023 EDT

Heterogeneous Integration with 3D Packaging

Rahul Agarwal, Patrick Cheng, Priyal Shah, Brett Wilkerson, Raja Swaminathan, John Wuu,
3D V-CacheHybrid Bonding3D packaging
https://doi.org/10.4071/001c.90022
IMAPSource Conference Papers
Agarwal, Rahul, Patrick Cheng, Priyal Shah, Brett Wilkerson, Raja Swaminathan, and John Wuu. 2023. “Heterogeneous Integration with 3D Packaging.” IMAPSource Proceedings 2022 (DPC): 38–63. https:/​/​doi.org/​10.4071/​001c.90022.
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