Hybrid Bonding for the Next Generation of High -Performance Devices

Laura Mirkarimi

doi:10.4071/001c.90016

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Mirkarimi, Laura. 2023. “Hybrid Bonding for the Next Generation of High -Performance Devices.” IMAPSource Proceedings 2022 (DPC): 945–70. https://doi.org/10.4071/001c.90016.

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