Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2022, Issue HiTEN, 2022
November 10, 2023 EDT
In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics
Yang Zuo
,
Samjid H. Mannan
,
Joining
Nanoparticle sintering
Oxide
Reduction sintering
•
https://doi.org/10.4071/001c.90012
IMAPSource Conference Papers
Zuo, Yang, and Samjid H. Mannan. 2023. “In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics.”
IMAPSource Proceedings
2022 (HiTEN): 131–34.
https://doi.org/10.4071/001c.90012
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats