Vol. 2022, Issue HiTEN, 2022November 10, 2023 EDT
In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics
In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics
Zuo, Yang, and Samjid H. Mannan. 2023. “In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics.” IMAPSource Proceedings 2022 (HiTEN): 131–34. https://doi.org/10.4071/001c.90012.
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