Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
High Temperature Conference Papers
Vol. 2022, Issue HiTEN, 2022
November 07, 2023 EDT
Direct Write Extreme Environment Packaging
David Shaddock
,
Cathleen Hoel
,
Jared Hale
,
Mark Poliks
,
Mohammed Alhendi
,
Firas Alshatnawi
,
Additive electronics
high temperature packaging
reliability
•
https://doi.org/10.4071/001c.89960
IMAPSource Conference Papers
Shaddock, David, Cathleen Hoel, Jared Hale, Mark Poliks, Mohammed Alhendi, and Firas Alshatnawi. 2023. “Direct Write Extreme Environment Packaging.”
IMAPSource Proceedings
2022 (HiTEN): 97–113.
https://doi.org/10.4071/001c.89960
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats