Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Liang-Yu Chen; Philip G. Neudeck; David J. Spry; Gary W. Hunter

doi:10.4071/001c.89946

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Chen, Liang-Yu, Philip G. Neudeck, David J. Spry, and Gary W. Hunter. 2023. “Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications.” IMAPSource Proceedings 2022 (HiTEN): 83–90. https://doi.org/10.4071/001c.89946.

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