Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT
Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications
Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications
Chen, Liang-Yu, Philip G. Neudeck, David J. Spry, and Gary W. Hunter. 2023. “Pt/HTCC Alumina Based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications.” IMAPSource Proceedings 2022 (HiTEN): 83–90. https://doi.org/10.4071/001c.89946.