ISSN 2380-4505
Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong, Bongmin, Kirak Son, Aesun Oh, Gawon Lee, and Hyuncheol Bae. 2023. “Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate.” IMAPSource Proceedings 2022 (HiTEN): 66–70. https://doi.org/10.4071/001c.89944.