Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate

Jeong, Bongmin, Kirak Son, Aesun Oh, Gawon Lee, and Hyuncheol Bae. 2023. “Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate.” IMAPSource Proceedings 2022 (HiTEN): 66–70. https:/​/​doi.org/​10.4071/​001c.89944.