Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT
Location dependent down-rating of voids in high power solder connections for automotive power modules
Location dependent down-rating of voids in high power solder connections for automotive power modules
Ottinger, Bettina, Simon Murk, Sebastian König, Antonio Zangarro, Michael J. Müllmaier, Dr. Lars Müller, and Prof. Dr. Jörg Franke. 2023. “Location Dependent Down-Rating of Voids in High Power Solder Connections for Automotive Power Modules.” IMAPSource Proceedings 2022 (HiTEN): 41–44. https://doi.org/10.4071/001c.89938.