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High Temperature Conference Papers
Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT

Location dependent down-rating of voids in high power solder connections for automotive power modules

Bettina Ottinger, Simon Murk, Sebastian König, Antonio Zangarro, Michael J. Müllmaier, Dr. Lars Müller, Prof. Dr. Jörg Franke,
die attachFEMlocationpower modulesolderingvoids
https://doi.org/10.4071/001c.89938
IMAPSource Conference Papers
Ottinger, Bettina, Simon Murk, Sebastian König, Antonio Zangarro, Michael J. Müllmaier, Dr. Lars Müller, and Prof. Dr. Jörg Franke. 2023. “Location Dependent Down-Rating of Voids in High Power Solder Connections for Automotive Power Modules.” IMAPSource Proceedings 2022 (HiTEN): 41–44. https:/​/​doi.org/​10.4071/​001c.89938.
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