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ISSN 2380-4505
High Temperature Conference Papers
Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT

Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction

Canyu Liu, Zhaoxia Zhou, Changqing Liu,
Self-propagating exothermic reactionCu-15Ag-5P brazing alloyIncusil alloyhigh-temperature electronics packaging
https://doi.org/10.4071/001c.89937
IMAPSource Conference Papers
Liu, Canyu, Zhaoxia Zhou, and Changqing Liu. 2023. “Bonding with Brazing Alloys as High-Temperature Interconnection Filler through Self-Propagating Exothermic Reaction.” IMAPSource Proceedings 2022 (HiTEN): 36–40. https:/​/​doi.org/​10.4071/​001c.89937.

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