Vol. 2022, Issue HiTEN, 2022November 07, 2023 EDT
Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction
Bonding with brazing alloys as high-temperature interconnection filler through self-propagating exothermic reaction
Liu, Canyu, Zhaoxia Zhou, and Changqing Liu. 2023. “Bonding with Brazing Alloys as High-Temperature Interconnection Filler through Self-Propagating Exothermic Reaction.” IMAPSource Proceedings 2022 (HiTEN): 36–40. https://doi.org/10.4071/001c.89937.