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High Temperature Conference Papers
Vol. 2023, Issue HiTEC, CICMT, Power, 2023October 17, 2023 EDT

Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology

Philip G. Neudeck, David J. Spry, Michael J. Krasowski, Carl W. Chang, José M. Gonzalez, Srihari Rajgopal, Norman F. Prokop, Lawrence C. Greer, Dorothy Lukco, Shamir Maldonado-Rivera, Christina M. Adams,
Silicon CarbideIntegrated CircuitJFETSiCMicroprocessorInterconnect
https://doi.org/10.4071/001c.89108
IMAPSource Conference Papers
Neudeck, Philip G., David J. Spry, Michael J. Krasowski, Carl W. Chang, José M. Gonzalez, Srihari Rajgopal, Norman F. Prokop, et al. 2023. “Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology.” IMAPSource Proceedings 2023 (HiTEC, CICMT, Power): 43–48. https:/​/​doi.org/​10.4071/​001c.89108.

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